Title:
樹脂モールド装置および樹脂モールド方法
Document Type and Number:
Japanese Patent JP5314876
Kind Code:
B2
Inventors:
Fumio Miyajima
Yoshio Watanabe
Tetsuya Nishizawa
Hiroaki Yamagishi
Yoshino Mitsushiro
Takashi Katayama
Yoshio Watanabe
Tetsuya Nishizawa
Hiroaki Yamagishi
Yoshino Mitsushiro
Takashi Katayama
Application Number:
JP2007279723A
Publication Date:
October 16, 2013
Filing Date:
October 27, 2007
Export Citation:
Assignee:
Apic Yamada Corporation
International Classes:
B29C33/72; B29C33/58; B29C45/76; H01L21/56
Domestic Patent References:
| JP2005205833A | ||||
| JP2003230750A | ||||
| JP60250915A | ||||
| JP2002134535A | ||||
| JP2002316112A | ||||
| JP7136599A | ||||
| JP1122417A | ||||
| JP9045714A | ||||
| JP2000108141A | ||||
| JP2002508249A | ||||
| JP2004290750A |
Attorney, Agent or Firm:
Takao Watanuki
Horimai Kazuharu
Horimai Kazuharu
Previous Patent: JPS5314875
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