Title:
樹脂成形方法
Document Type and Number:
Japanese Patent JP7137228
Kind Code:
B2
Abstract:
To provide a resin molding method which can reduce a used amount of micropellets and can obtain a resin molding having required characteristics.SOLUTION: A resin molding method includes: an arrangement step of arranging a preliminary molding 2 that is layered and molded in a three-dimensional shape in a molding die 3; a filling step of heating and melting the preliminary molding 2 with electromagnetic waves permeated through the molding die 3, and filling the inside of the molding die 3 with a melted resin material 20; and a cooling step of cooling and solidifying the melted resin material 20 in the molding die 3. In the cooling step, a resin molding integrated so that a laminate interface 21 of the preliminary molding 2 is eliminated is molded in the molding die 3.SELECTED DRAWING: Figure 2
Inventors:
Fumio Kurihara
Shingo Kagawa
Shingo Kagawa
Application Number:
JP2020029557A
Publication Date:
September 14, 2022
Filing Date:
February 25, 2020
Export Citation:
Assignee:
Micro-AMS Co., Ltd.
International Classes:
B29C39/24; B29C39/26; B29C39/38; B29C64/106; B29C64/118; B29C64/153; B29C69/02; B33Y10/00
Domestic Patent References:
| JP2020183110A | ||||
| JP2018015148A | ||||
| JP2015131479A | ||||
| JP2013035703A |
Foreign References:
| WO2017213666A1 | ||||
| US20160332388 | ||||
| WO2015194378A1 | ||||
| WO2012072848A1 | ||||
| EP2722146A1 |
Attorney, Agent or Firm:
Patent Business Corporation Aichi International Patent Office
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