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Patent Searching and Data


Title:
RESIN MOLDING SYSTEM AND METHOD
Document Type and Number:
Japanese Patent JP2004114314
Kind Code:
A
Abstract:

To provide a resin molding system which enables molding of a resin without using a resin injection device, and a resin molding method using this system.

The resin molding system 10 comprises a pressure tank 12 capable of reducing its internal pressure by a non-illustrated vacuum generator and a molding device 14 installed inside the pressure tank 12. In the molding device 14, the space between a mixer 20 and a combination molding die 23 is partitioned by a differential pressure on-off valve 22. Following the internal pressure reduction of the pressure tank 12, the internal pressure of the combination molding die 23 is also reduced but that of the mixer 20 is not reduced, giving rise to a pressure difference between both. When the pressure reduction is further underway and the pressure difference reaches a specified value, the differential pressure on-off valve 22 is actuated and the mixer 20 and the combination molding die 23 are made to communicate with each other, The differential pressure prompts the injection of a matrix and a curing mixed in the mixer 20 into the combination molding die 23 in which a reinforcing fiber is laid. After that, the mixture undergoes a specified curing process and a finished FRP product is obtained.


Inventors:
NAKAMURA HIROYUKI
Application Number:
JP2002276567A
Publication Date:
April 15, 2004
Filing Date:
September 24, 2002
Export Citation:
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Assignee:
NIKKISO CO LTD
International Classes:
B29C39/26; B29C39/10; B29C39/22; B29C39/42; B29K105/08; (IPC1-7): B29C39/10; B29C39/22; B29C39/26; B29C39/42
Attorney, Agent or Firm:
Kenji Yoshida
Jun Ishida