Title:
RESIN PARTICLE AND MANUFACTURING PROCESS THEREFOR
Document Type and Number:
Japanese Patent JP2005048176
Kind Code:
A
Abstract:
To provide a resin particle which is excellent in concealing ability when it is used as an additive for coating materials or cosmetics, is excellent in ink retention when it is used as an additive for paper painting and is excellent in abrasion ability when it is used as an abrasive.
The resin particle contains (a) a resin and (b) a filler. The particle has a volume average particle size of 0.1-300 μm and a shape factor (SF-2) of 110-300, has a shell (S) consisting of at least a part of (b). The shell (S) has a thickness of at least 0.01 μm and not more than a half of the radius of the maximum inscribed circle of the particle cross section.
Inventors:
TAKIGAWA TADAO
KANO TOSHIHIKO
YOSHIDA YUTAKA
KANO TOSHIHIKO
YOSHIDA YUTAKA
Application Number:
JP2004207887A
Publication Date:
February 24, 2005
Filing Date:
July 14, 2004
Export Citation:
Assignee:
SANYO CHEMICAL IND LTD
International Classes:
C08J3/12; C08J3/22; (IPC1-7): C08J3/12; C08J3/22
Domestic Patent References:
| JP2002284881A | 2002-10-03 | |||
| JP2002220477A | 2002-08-09 | |||
| JPH05214054A | 1993-08-24 | |||
| JPH04363330A | 1992-12-16 | |||
| JP2000181134A | 2000-06-30 | |||
| JP2001181403A | 2001-07-03 | |||
| JP2002121421A | 2002-04-23 |
Foreign References:
| WO2003037964A1 | 2003-05-08 |