Title:
ダイボンディング用樹脂ペーストおよびその用途
Document Type and Number:
Japanese Patent JP5360124
Kind Code:
B2
Abstract:
Disclosed is a resin paste for die bonding comprising a butadiene homopolymer or copolymer (A) having a carboxylic acid terminal group, a thermosetting resin (B), a filler (C), and a printing solvent (D), wherein the elastic modulus of the resin paste following drying and curing is within a range from 1 to 300 MPa (25°C). The solid fraction is preferably from 40 to 90% by weight, the thixotropic index is preferably from 1.5 to 8.0, and the viscosity (25°C) is preferably from 5 to 1,000 Pa·s. Using this resin paste, a semiconductor device is produced by a method comprising (1) applying a predetermined quantity of the resin paste to a substrate, (2) drying the resin paste to effect B-staging of the resin, (3) mounting a semiconductor chip on the B-staged resin, and (4) conducting post-curing of the resin.
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Inventors:
Yuji Hasegawa
Kikuchi
Satoshi Ehana
Yasuhisa Odagawa
Kawasumi Masao
Mitsuo Yamazaki
Kikuchi
Satoshi Ehana
Yasuhisa Odagawa
Kawasumi Masao
Mitsuo Yamazaki
Application Number:
JP2011098093A
Publication Date:
December 04, 2013
Filing Date:
April 26, 2011
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
H01L21/52; C08L13/00; C09J11/04; C09J11/06; C09J109/00; H01L21/58; C08K3/00; C08L63/00
Domestic Patent References:
| JP7238269A | ||||
| JP2001247780A | ||||
| JP2004172443A |
Attorney, Agent or Firm:
Hidekazu Miyoshi
Iwa Saki Kokuni
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu
Iwa Saki Kokuni
Masakazu Ito
Shunichi Takahashi
Toshio Takamatsu