Title:
RESIN PASTE FOR SEMICONDUCTOR AND DEVICE USING THE SAME
Document Type and Number:
Japanese Patent JP2002105285
Kind Code:
A
Abstract:
To provide a resin paste for a semiconductor, which gives a cured product low in stress and reduces warping of a semiconductor element after cured.
The resin paste for semiconductor is composed of (A) an epoxy resin containing a long chain alicyclic epoxy resin of 20-80 wt.% in the total epoxy resin, (B) a metal complex, (C) a phenol compound and (D) a silver powder.
Inventors:
NAITO MANABU
Application Number:
JP2000294428A
Publication Date:
April 10, 2002
Filing Date:
September 27, 2000
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08L63/00; C08G59/22; C08G59/62; C08K3/08; C08K5/1575; H01L21/52; (IPC1-7): C08L63/00; C08G59/22; C08G59/62; C08K3/08; C08K5/1575; H01L21/52
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