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Title:
RESIN PLATE FOR LOWER ELECTRODE SUBSTRATE, LOWER ELECTRODE PLATE AND TOUCH PANEL
Document Type and Number:
Japanese Patent JP2012178090
Kind Code:
A
Abstract:

To provide a resin plate for lower electrode substrate which is lightly weighted, which is hardly cracked, and which is excellent in environmental resistance characteristics for suppressing the generation of camber or undulation under high humidity, a lower electrode plate and a touch panel.

Disclosed is a resin plate for lower electrode substrate configured as a resin plate to be used for the lower electrode substrate of a touch panel consisting of a 5 layer structure in which a layer (B) made of methyl methacrylate/styrene copolymer resin and a layer (C) made of polycarbonate-based resin are laminated in this order on each of the both surfaces of a layer (A) made of polystyrene-based resin. Also, disclosed is a lower electrode plate configured such that a transparent electrode film is formed on one surface of the resin plate for lower electrode substrate and a touch panel using this lower electrode plate.


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Inventors:
MAEKAWA TOMOHIRO
Application Number:
JP2011041177A
Publication Date:
September 13, 2012
Filing Date:
February 28, 2011
Export Citation:
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Assignee:
SUMITOMO CHEMICAL CO
International Classes:
G06F3/041; B32B7/02; B32B27/30; B32B27/36
Attorney, Agent or Firm:
Toshikazu Fukai