RESIN, POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE COMPOSITION

Title:

RESIN, POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD USING THE COMPOSITION

Document Type and Number:

Japanese Patent JP2008195868

Kind Code:

A

Abstract:

To provide a positive resist composition improved in LER (line edge roughness), pattern collapse and development faults.

A resin having recurring units represented by general formula (I), produced by living radical polymerization and capable of becoming alkali-solubilized by the action of an acid is provided, and a resist composition containing the resin and a pattern forming method using the composition are also provided. (Wherein, Xa1 is an hydrogen atom, an alkyl group or a cycloalkyl group; and R is an acid-decomposable group containing a monocyclic alicycle).

Inventors:

KANEKO YUJI
KAMIMURA SATOSHI
OTANI TADAHIRO

Application Number:

JP2007033766A

Publication Date:

August 28, 2008

Filing Date:

February 14, 2007

Export Citation:

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Assignee:

FUJIFILM CORP

International Classes:

C08F20/12; C08F2/38; G03F7/004; G03F7/039; H01L21/027

Attorney, Agent or Firm:

Takeshi Takamatsu
Kiyozumi Yazawa

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