Title:
樹脂製品の製造システム
Document Type and Number:
Japanese Patent JP5611027
Kind Code:
B2
Abstract:
A resin product manufacturing system includes: molding apparatuses for forming substrates; a substrate removal apparatus for removing the substrates from the molding apparatuses; a metal film deposition apparatus for forming a metal film on the substrates to obtain intermediate products; a substrate carrying machine for carrying the substrates into the metal film deposition apparatus; an intermediate product removal machine for removing the intermediate products from the metal film deposition apparatus; a coating film forming apparatus for forming a coating film on the intermediate products to obtain resin products; an intermediate product carrying machine for carrying the intermediate products into the coating film forming apparatus; first and second transfer apparatuses for transferring the substrates; a first control unit for controlling the substrate removal apparatus; a second control unit for controlling the intermediate product removal apparatus and the metal film deposition apparatus; and a third control unit for controlling the carrying machine.
Inventors:
伊藤 薫
森岡 康行
早川 宗孝
伊藤 隆昭
森岡 康行
早川 宗孝
伊藤 隆昭
Application Number:
JP2010288291A
Publication Date:
October 22, 2014
Filing Date:
December 24, 2010
Export Citation:
Assignee:
小島プレス工業株式会社
International Classes:
B29C69/00
Attorney, Agent or Firm:
Nakajima Michio
Masahiro Nakajima
Masahiro Nakajima