PURPOSE: To realize hollow structure, in which an element and a resin are not brought into contact on resin seal, positively by forming a sidewall surrounding the side of the chip-shaped element continuously or intermittently integrally with or in a separate body from an island section for mounting the chip-shaped element.

CONSTITUTION: With an island section 5 for a lead frame, a sidewall 21 is shaped along an outer periphery, and the sidewall 21 has slits 23. An element 1 is mounted onto the island section 5, and the inside of a recessed section is filled with a liquefied or solvent-diluted subliming substance such as wax 7 or a foaming agent. The subliming substance does not leak from the slits 23 owing to surface tension, and a central section protrudes. When the temperature of fillers is elevated to a fixed temperature or more on resin seal and the fillers are sublimed or foamed and removed, a hollow section 2 having sufficient size in which the element and a resin are not brought into contact is realized positively around an element mounting section.