Title:
RESIN-SEALED SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPH02156662
Kind Code:
A
Abstract:
PURPOSE: To reduce an area of a semiconductor-element mounting part and to reduce a crack of a resin-sealed semiconductor by a method wherein one semiconductor-element mounting part is used in common and semiconductor elements are mounted on both faces of the mounting part.
CONSTITUTION: Semiconductor elements 2 are attached to both faces of one semiconductor mounting part 1; terminals formed at the elements 2 at inside end parts of a lead frame 4 are connected by using metal thin wires 3. Thereby, a high-density mounting operation can be executed easily; a resin-sealed semiconductor can be made small in size.
Inventors:
SAKAGUCHI SHIGEKI
Application Number:
JP31232988A
Publication Date:
June 15, 1990
Filing Date:
December 09, 1988
Export Citation:
Assignee:
MATSUSHITA ELECTRONICS CORP
International Classes:
H01L25/18; H01L21/52; H01L23/28; H01L23/50; H01L25/065; H01L25/07; (IPC1-7): H01L21/52; H01L23/28; H01L23/50; H01L25/065; H01L25/07; H01L25/18
Attorney, Agent or Firm:
Shigetaka Awano (1 person outside)