PURPOSE: To obtain the titled device excellent in moisture resistance and simple in production by a method wherein an inner package with a semiconductor element, bonding wires, and at least part of a lead frame sealed with resin is formed in the recess of a recess member partly made of ultraviolet-permeable material, and the whole package is then sealed with resin.
CONSTITUTION: An element 1 is fixed on the island 3 of a lead frame with a mount member 2 made of an epoxy series paste. Next, the element 1 is bonded to the lead parts 5 of the lead frame with Au bonding wires 4. The lead frame finished in bonding is turned upside down and installed on a recess member 8 made of clear alumina and secured with an adhesive layer 12 made of an epoxy series adhesive. Then, a clear sealing resin 13, clear silicone resin, is cast in the recess and cured by heating, thus forming an inner package 14. Further, this package 14 is installed in a transfer mold metal die 15, and an epoxy resin is cast through a casting port 16 into the cavity and cured by heating, resulting in the formation of a resin-sealed body 11.
SHOJI FUSAJI
KOMARU TAKESHI
