RESIN-SEALED SEMICONDUCTOR DEVICE

Title:

RESIN-SEALED SEMICONDUCTOR DEVICE

Document Type and Number:

Japanese Patent JPS63257253

Kind Code:

A

Abstract:

PURPOSE: To enhance the reliability of dampproofness by a method wherein a sealing resin is composed of a phenol-hardening epoxy-resin molding material containing a tetra-substituted borate of quaternary phosphonium.

CONSTITUTION: A plastic-packaged semiconductor device is obtained in such a way that it has a multilayer wiring structure using a polyimide resin as an interlayer insulating film on the surface of a semiconductor substrate. During this process, a sealing resin is composed of a phenol-hardening epoxy-resin molding material using a tetra-substituted borate of a quaternary phosphonium as an accelerator of hardening. The coefficient of thermal expansion of the polyimide resin is less than 2.0×10-5/°C. Then, the bonding performance with reference to the rear of a tub where a chip is mounted, a connector wire of a lead and the molding material is enhanced. By this setup, the reliability of dampproofness is enhanced.

Inventors:

OGATA MASAJI
SUGAWARA YASUHIDE
KAWADA TATSUO

Application Number:

JP9077287A

Publication Date:

October 25, 1988

Filing Date:

April 15, 1987

Export Citation:

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Assignee:

HITACHI LTD
HITACHI CHEMICAL CO LTD

International Classes:

C08G59/70; C08G59/00; C08G59/40; C08L63/00; H01L21/768; H01L23/29; H01L23/31; H01L23/522; (IPC1-7): C08G59/40; C08G59/70; C08L63/00; H01L21/90; H01L23/30

Attorney, Agent or Firm:

Katsuo Ogawa

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