樹脂封止型半導体装置および半導体装置封止用樹脂組成物

Title:

樹脂封止型半導体装置および半導体装置封止用樹脂組成物

Document Type and Number:

Japanese Patent JP4033990

Kind Code:

B2

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Inventors:

Tetsuya Saegusa
Yasuaki Tsutsumi
Masayuki Tanaka

Application Number:

JP34624698A

Publication Date:

January 16, 2008

Filing Date:

December 04, 1998

Export Citation:

Assignee:

Sumitomo Bakelite Co., Ltd.

International Classes:

C08L19/00; H01L23/29; C08G59/40; C08L63/00; H01L23/31

Domestic Patent References:

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