PURPOSE: To reduce an opportunity of bringing an outer leads into contact with an resin sealed part by an external force and to prevent a malfunction due to bending of a pin by increasing the sealed part of a covering part of the lead.
CONSTITUTION: An outer lead 3 is exposed externally from a sealed part 1. The lead 3 has a vertical part 31 bent perpendicularly from a parallel part 30 with the part 1, and its end 32 is so flatly formed as to be bent in parallel with the part 1 and to be surface-mounted on a mounting circuit board. The part 1 is formed on most part of the part 30 and the part 31 to cover an outer exposed part of the lead 3 to the vicinity of the end 32. Thus, an area of the exposed part from the part 1 of the lead 3 is reduced to prevent bending of a pin.
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HITACHI COMPUTER ENG
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