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Patent Searching and Data


Title:
RESIN-SEALED SEMICONDUCTOR FLAT PACKAGE
Document Type and Number:
Japanese Patent JPH05291460
Kind Code:
A
Abstract:

PURPOSE: To reduce an opportunity of bringing an outer leads into contact with an resin sealed part by an external force and to prevent a malfunction due to bending of a pin by increasing the sealed part of a covering part of the lead.

CONSTITUTION: An outer lead 3 is exposed externally from a sealed part 1. The lead 3 has a vertical part 31 bent perpendicularly from a parallel part 30 with the part 1, and its end 32 is so flatly formed as to be bent in parallel with the part 1 and to be surface-mounted on a mounting circuit board. The part 1 is formed on most part of the part 30 and the part 31 to cover an outer exposed part of the lead 3 to the vicinity of the end 32. Thus, an area of the exposed part from the part 1 of the lead 3 is reduced to prevent bending of a pin.


Inventors:
HOSHINO HISANOBU
Application Number:
JP9258892A
Publication Date:
November 05, 1993
Filing Date:
April 13, 1992
Export Citation:
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Assignee:
HITACHI LTD
HITACHI COMPUTER ENG
International Classes:
H01L23/28; H01L23/50; H05K3/34; (IPC1-7): H01L23/50; H01L23/28
Attorney, Agent or Firm:
Ogawa Katsuo