Title:
RESIN-SEALED TYPE SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPH05259360
Kind Code:
A
Abstract:
PURPOSE: To thin down a package and to prevent defectives.
CONSTITUTION: The chip mount part 11 of a lead frame 1 is shaped into a cross which combine counter ones of four suspension leads 12 in a striplike manner. The rear of a semiconductor chip 2 is provided with a groove 21 to insert the chip mount part 11, which is inserted and fixed in this groove 21.
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Inventors:
Keito Eto
Application Number:
JP5120592A
Publication Date:
October 08, 1993
Filing Date:
March 10, 1992
Export Citation:
Assignee:
NEC
International Classes:
H01L21/52; H01L21/56; H01L23/50; (IPC1-7): H01L23/50; H01L21/52; H01L21/56
Attorney, Agent or Firm:
Naoki Kyomoto (2 outside)