PURPOSE: To compactly obtain a resin sealing apparatus, to eliminate the machining of through holes for a plurality of plungers to platens and to easily form the passage of a plurality of flexible transmission members by individually transmitting the reciprocating driving forces of a plurality of reciprocating means through the plurality of members arranged in parallel to the plungers.
CONSTITUTION: Upper and lower metal molds 46 for containing a semiconductor element, a plurality of plungers 43 for press-fitting resin into the molds 46, a plurality of reciprocating means for individually reciprocating the plungers 43, and a plurality of flexible transmission members 42 so arranged in parallel as to individually transmit the reciprocating driving forces of the means by coupling the outputs 39 of the means to the plungers 43 to the plungers 43 are provided. For example, the reciprocating means are composed of the outputs 39 made of ball screws, and servo motors 22 for driving the outputs 39, and the members 42 are composed of chains.
UCHIDA TETSUYA
KIDERA TORU
