Title:
RESIN-SEALING DEVICE FOR SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS6399538
Kind Code:
A
Abstract:
PURPOSE: To prevent the attachment of resin to the end part of a lead frame, by arranging caulking blocks which extend both ends of the lead frame to its outside, at both ends of a cavity block.
CONSTITUTION: When a cavity block 2 of a bottom force and a cavity block 6 of a top force are clamped, both end parts 5a of a lead frame 5 are caulked by the wedge action of tapered surfaces 7a of caulking blocks 7. Therefore, the lead frame is deformed. The deformed part closes a gap δ. Thus the resin, which leaks from a gate part 2b, is stopped with the deformed part of the lead frame 5. Therefore attachment of the resin to an end surface 5b of the lead frame is prevented.
Inventors:
TANAKA SUEKICHI
Application Number:
JP24580186A
Publication Date:
April 30, 1988
Filing Date:
October 15, 1986
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
B29C45/02; B29C45/14; B29C45/26; H01L21/56; B29L31/34; (IPC1-7): B29C45/02; B29C45/14; B29C45/26; B29L31/34; H01L21/56
Attorney, Agent or Firm:
Kaneo Miyata (3 outside)
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