Title:
RESIN SEALING METHOD AND RESIN SEALING MOLD
Document Type and Number:
Japanese Patent JP2021093512
Kind Code:
A
Abstract:
To provide a resin sealing method and a resin sealing mold capable of performing temperature control of a mold with high accuracy in performing resin sealing of a semiconductor element mounted on a base material.SOLUTION: A resin sealing method is a resin sealing method for repeatedly performing a molding operation multiple times with an operation for performing resin sealing of a semiconductor element mounted on a base material as a molding operation for one time in a resin sealing mold, and includes: an acquisition step for acquiring information on temperature change of at least one of a cull block and a cavity block in respective molding operations for molding operations of multiple times by temperature measurement means; a calculation step for calculating adjustment contents of heating in a molding operation for one time by heating means until a molding operation after the preceding time is executed on the basis of information of the temperature change acquired in the acquisition step in a molding operation before the preceding time among the molding operations for multiple times; and an execution step for executing heating by the heating means in a molding operation after the preceding time according to the adjustment contents calculated in the calculation step.SELECTED DRAWING: Figure 7
Inventors:
MASUDA KOSAKU
NAKAHARA NORIMASA
NISHIMURA TOSHITSUGU
NAKAHARA NORIMASA
NISHIMURA TOSHITSUGU
Application Number:
JP2020106222A
Publication Date:
June 17, 2021
Filing Date:
June 19, 2020
Export Citation:
Assignee:
I PEX CO LTD
International Classes:
H01L21/56; B29C33/02; B29C45/02; B29C45/26
Attorney, Agent or Firm:
Sakai International Patent Office