Title:
RESIN-SEALING SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2003007933
Kind Code:
A
Abstract:
To suppress a sealing resin from cracking under the stress caused by the difference in linear expansion factors between a heat sink and the sealing resin, related to a resin-sealing semiconductor device where the heat sink on which a semiconductor chip is mounted is sealed with resin.
A semiconductor chip is mounted on one surface side of a heat sink 1 while a recess 7a is formed on the other surface 1b of the heat sink 1 which is exposed from a sealing resin 6, to constitute a deformable escape part 7 for releasing the stress developed at the sealing resin 6.
Inventors:
HONDA MASAHIRO
HARADA YOSHIHARU
MIZUNO NAOHITO
HARADA YOSHIHARU
MIZUNO NAOHITO
Application Number:
JP2001195328A
Publication Date:
January 10, 2003
Filing Date:
June 27, 2001
Export Citation:
Assignee:
DENSO CORP
International Classes:
H01L23/34; H01L23/28; (IPC1-7): H01L23/34; H01L23/28
Attorney, Agent or Firm:
Yoji Ito (2 outside)