PURPOSE: To lower the internal stress of a shape, and to improve wetproof property and corrosion resistance by sealing the semiconductor device with a composition obtained by each compounding quantities within the predetermined ranges of silicon resin, a flexible acid anhydride, an organic Al compound and inorganic fillers to epoxy resin.
CONSTITUTION: The composition manufactured by compounding the following (a)W(e) is used as th thermocuring resin composition sealing an element. (a) 5W 25wt% resin such as a bisphenol A group epoxy resin, epoxy equivalent thereof is 250 or lower and the softening point thereof is 60W110°C. (b) 1W8wt% silicon resin (a curing agent), hydroxyl group equivalent of hydroxyl groups thereof dirctly combining with silicon elements is 100W500 and the softening point thereof is 60W110°C. (c) A 1W8wt% curing agent such as the denatured liquefied acid anhydride. (d) A 0.01W2w% substance such as Al isopropoxide as a reaction accelerator. (e) A 65W82wt% substance such as non-alkaline crystalline silica as the fillers. A fire retardant, a pigment, a release agent, etc. are properly compounded to these materials as necessary. Accordingly, the composition suitable for a low pressure transfer method can be obtained.
AZUMA MICHIYA
KOKUBO ATSUO
SUZUKI SHIYUICHI
