To provide a resin surface polishing device having an excellent easiness of handling and capable of reducing a cost required for polishing.
In this resin surface polishing device, polishing particles are fixed to a main material formed of sponge having water absorbing and holding capacities. The percentage by weight of fallen materials when the polishing device is manually crumpled 20 times in water to a main material before immersing in water is 3.0 wt.%, desirably 2.0 wt.% or less. The primary averaged grain size of the polishing particles is 0.2 to 80 μm, desirably 1 to 60 μm. The percent by weight of polishing particles content when the percentage by weight of those components other than the polishing particles is 100 wt.% is 10 to 600 wt.%, desirably 40 to 500 wt.%.
OKADA YUICHIRO
HIDAKA RYUTARO
OKAHATA TAKUYA
MANO TOSHIMASA
AION KK
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