Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
RESIN VARNISH, CARRIER MATERIAL WITH RESIN, PREPREG, AND LAMINATED BOARD
Document Type and Number:
Japanese Patent JP2011202053
Kind Code:
A
Abstract:

To provide a resin varnish that has little dissolved oxygen content therein and few defects in appearance when molding, and a carrier material with a resin, a prepreg, and a laminated board using the resin varnish.

The resin varnish is used for forming an insulating layer. The resin varnish is composed of a resin composition including a thermosetting resin, a filler, and a solvent, and has the dissolved oxygen content of 50% or less.


Inventors:
HAMAYA KAZUYA
Application Number:
JP2010071329A
Publication Date:
October 13, 2011
Filing Date:
March 26, 2010
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08L101/00; B32B27/20; C08J5/04; H05K1/03
Domestic Patent References:
JPH10287833A1998-10-27
JP2006328105A2006-12-07
JP2004123987A2004-04-22
JP2002252470A2002-09-06
JP2009132886A2009-06-18
JPS5757625A1982-04-06
JP2006257212A2006-09-28
JPH10287833A1998-10-27
JP2006328105A2006-12-07
JPS5757625A1982-04-06
JP2004123987A2004-04-22
JP2002252470A2002-09-06
JP2009132886A2009-06-18
JP2006257212A2006-09-28



 
Previous Patent: MODIFIED ETHYLENE-VINYL ALCOHOL COPOLYMER, AND COMPOSITION CONTAINING THE SAME

Next Patent: TACKIFIER FOR STYRENIC BLOCK COPOLYMER, TACKIFIER RESIN, AND ADHESIVE COMPOSITION CONTAINING STYRENI...