Title:
RESIN WAVEGUIDE AND MANUFACTURING METHOD THEREOF
Document Type and Number:
Japanese Patent JP2021016075
Kind Code:
A
Abstract:
To provide a resin waveguide with high airtightness.SOLUTION: A resin waveguide 3 is provided by bonding together a plurality of resin waveguide components 1 and 2 by vibration welding.SELECTED DRAWING: Figure 3
Inventors:
SEKINO NOBORU
Application Number:
JP2019129518A
Publication Date:
February 12, 2021
Filing Date:
July 11, 2019
Export Citation:
Assignee:
DENKI KOGYO CO LTD
International Classes:
H01P3/12; H01P11/00
Attorney, Agent or Firm:
Shoichi Okuyama
Matsushima Tetsuo
Ayako Nakamura
Satoshi Morimoto
Yu Tanaka
Tokumoto Koichi
Arihara Koichi
Matsushima Tetsuo
Ayako Nakamura
Satoshi Morimoto
Yu Tanaka
Tokumoto Koichi
Arihara Koichi