PURPOSE: To control effectively the temperature of a resist at a set value, by adjusting the resist temperature with an element having the Peltier effect, and spreading the resist by dripping it to the surface of a substrate.

CONSTITUTION: From a resist supplying source, the resist is dripped, via a resist supplying pipe 11, to the surface of a substrate 1 to be processed, and is spread. An element having the Peltier effect, e.g., thermo-module is arranged so as to come into contact with the outer wall of the supplying pipe 11. The thermo-module is composed of an N-type semiconductor 12 and a P-type semiconductor 13, and one end of the semiconductor 12 and one end of the semiconductor 13 are connected to a copper plate 14a, which is arranged on the outer wall of the supplying pipe 11. The temperature of the supplying pipe 11 is adjusted by using the thermo-module. Thereby, the resist temperature is effectively controlled at a set value.