PURPOSE: To increase the uniformity of resist film thickness, and improve device characteristics, by a method wherein a resist film is spread, while the temperature distribution of a substrate is controlled by controlling the output of each infrared ray projected on the substrate from each fiber.

CONSTITUTION: A substrate 1 is irradiated with infrared rays 4 from a plurality of infrared radiation fibers 3. While the temperature distribution of the substrate 1 is controlled by controlling each output of the infrared rays 4, the substrate 1 is coated with a resist film 2. Thereby the thickness of the resist film is controlled for parts where substrate temperature is high and parts where the substrate temperature is low, so that the thickness of the resist film on the rotated substrate is compulsorily made uniform.