Title:
RESIST COMPOSITION, RESIST PATTERN FORMING METHOD, COMPOUND, AND POLYMER COMPOUND
Document Type and Number:
Japanese Patent JP2023131576
Kind Code:
A
Abstract:
To provide a resist composition achieving higher sensitivity and having good lithographic characteristics, a resist pattern forming method using the resist composition, a polymer compound usable for producing the resist composition, and a compound usable for synthesizing the polymer compound.SOLUTION: The resist composition, which generates an acid upon exposure and whose solubility in a developer changes by the action of an acid, contains a resin component (A1) whose solubility in a developer changes by the action of an acid. The resin component (A1) has a constituent unit (a0) represented by the following general formula (a0-1).SELECTED DRAWING: None
Inventors:
MIYAGAWA JUNICHI
ADACHI YOHEI
FUJINAMI TETSURO
ISHII SHUICHI
ADACHI YOHEI
FUJINAMI TETSURO
ISHII SHUICHI
Application Number:
JP2022036420A
Publication Date:
September 22, 2023
Filing Date:
March 09, 2022
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD
International Classes:
G03F7/039; C07C309/12; C07C381/12; C07D307/00; C07D327/06; C07D333/46; C07D333/76; C08F12/20; C08F20/22; G03F7/004; G03F7/20
Attorney, Agent or Firm:
田▲崎▼ 聡
Ryu Miyamoto
Emi Hattori
Takuya Shiraishi
Ryu Miyamoto
Emi Hattori
Takuya Shiraishi