Title:
レジスト組成物、及びレジストパターン形成方法
Document Type and Number:
Japanese Patent JP7418488
Kind Code:
B2
Abstract:
The present invention employs a resist composition which generates an acid upon exposure to light and changes the solubility with respect to a developer solution by the action of the acid, and which contains a compound that is represented by general formula (d0). In general formula (d0), RAr represents an aromatic hydrocarbon group; t represents an integer of 1 or more; each of R01 and R02 represents a chain hydrocarbon group, and R03 represents a chain hydrocarbon group or a hydrogen atom; or alternatively, two or more moieties among the R01, R02 and R03 moieties combine with each other to form a ring structure; m represents an integer of 1 or more; and Mm+ represents an organic cation having a valence of m. This resist composition is capable of enhancing both the roughness characteristics and the effect of suppressing the occurrence of a defect.
Inventors:
Daichi Takagi
Takeshi Nakamura
Takashi Nagamine
Takeshi Nakamura
Takashi Nagamine
Application Number:
JP2022065655A
Publication Date:
January 19, 2024
Filing Date:
April 12, 2022
Export Citation:
Assignee:
Tokyo Ohka Kogyo Co., Ltd.
International Classes:
G03F7/004; C07C65/05; C07C65/105; C07C65/17; C07C381/12; G03F7/039; G03F7/20
Domestic Patent References:
| JP2011090147A | ||||
| JP2018172525A | ||||
| JP2006306933A | ||||
| JP2004532141A |
Attorney, Agent or Firm:
田▲崎▼ 聡
Ryu Miyamoto
Emi Hattori
Takuya Shiraishi
Ryu Miyamoto
Emi Hattori
Takuya Shiraishi