Title:
RESIST INK, PROTECTIVE FILM OF WIRING, METHOD FOR PRODUCING THE SAME, SEMICONDUCTOR SUBSTRATE, AND METHOD FOR PRODUCING PROTECTIVE FILM THEREOF
Document Type and Number:
Japanese Patent JP2019068062
Kind Code:
A
Abstract:
To provide a resist ink which is capable of forming a cured product excellent in acid resistance and has excellent printability.SOLUTION: The resist ink contains: a (meth)allyl group-containing compound (A) having two or more (meth)allyl groups in one molecule; a thiol compound (B) having two or more mercapto groups in one molecule; a polymerization initiator (C); and a thixotropic agent (D). The resist ink has a thixotropy index of 1.05 or more and 4.00 or less.SELECTED DRAWING: None
Inventors:
SUZUKI KAI
OGA KAZUHIKO
OGA KAZUHIKO
Application Number:
JP2018175646A
Publication Date:
April 25, 2019
Filing Date:
September 20, 2018
Export Citation:
Assignee:
SHOWA DENKO KK
International Classes:
H05K3/00; C08F2/46; C09D11/101; H05K3/28
Domestic Patent References:
| JP2006070248A | 2006-03-16 | |||
| JP2016145866A | 2016-08-12 | |||
| JP2010132751A | 2010-06-17 |
Foreign References:
| WO2014203779A1 | 2014-12-24 | |||
| WO2011004756A1 | 2011-01-13 | |||
| WO2009142237A1 | 2009-11-26 |
Attorney, Agent or Firm:
Hide Tanaka Tetsu
Tetsuya Mori
Tetsuya Mori