Title:
Restoration of a penetration hole
Document Type and Number:
Japanese Patent JP6073438
Kind Code:
B2
Abstract:
Pulse plating methods which include a forward pulse but no reverse pulse inhibit or reduce dimpling and voids during copper electroplating of through-holes in substrates such as printed circuit boards. The pulse plating methods may be used to fill through-holes with copper where the through-holes are coated with electroless copper or flash copper.
Inventors:
Nagarajan Jayaraju
Leon Earl Burstad
Eli H Nager
Leon Earl Burstad
Eli H Nager
Application Number:
JP2015200996A
Publication Date:
February 01, 2017
Filing Date:
October 09, 2015
Export Citation:
Assignee:
Rohm and Haas Electronic Materials LLC
International Classes:
C25D5/18; C25D7/00; H05K1/11; H05K3/40; H05K3/42
Domestic Patent References:
| JP2004128053A | ||||
| JP2005320631A | ||||
| JP2010118645A | ||||
| JP2011520039A | ||||
| JP2000169998A | ||||
| JP2014053594A | ||||
| JP2013219350A | ||||
| JP2012136765A |
Foreign References:
| US20140262794 |
Attorney, Agent or Firm:
Patent Business Corporation Sender International Patent Office