Title:
RETAINING OF THIN PLATE MATERIAL
Document Type and Number:
Japanese Patent JPS60242926
Kind Code:
A
Abstract:
PURPOSE: To facilitate retaining of thin plate material on a surface plate and improve retaining precision thereof by interposing buffer material between the surface plate and the thin plate material and adsorbingly retaining the thin plate material by vacuum.
CONSTITUTION: There are provided a plurality of vacuum adsorbing ports 4 vertically extending through a surface plate 2 and a buffer material 3, and the adsorbing ports 4 are connected through an adsorbing passage-forming member 5 to a vacuum adsorbing source 6. Then, a thin plate material 1 such as semiconductor wafer is adsorbedly retained through the buffer material 3 on the surface plate 2. This allows flat and precise retaining of the thin plate material on the surface plate.
Inventors:
YUI HAJIME
CHIKAOKA RIYOUSAKU
MURAYAMA TOSHIO
TAKAHASHI KAZUHIKO
HIRAIDE HATSUO
CHIKAOKA RIYOUSAKU
MURAYAMA TOSHIO
TAKAHASHI KAZUHIKO
HIRAIDE HATSUO
Application Number:
JP9645584A
Publication Date:
December 02, 1985
Filing Date:
May 16, 1984
Export Citation:
Assignee:
HITACHI LTD
International Classes:
B23Q3/08; H01L21/67; H01L21/68; H01L21/683; (IPC1-7): B23Q3/08; H01L21/68
Attorney, Agent or Firm:
Akio Takahashi
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