To provide a robot hand for carrying a thin wafer in which contact due to drooping is prevented when the thin wafer is carried.

The robot hand has a body 1 provided with sliding parts 2 and 2 being guided to sliding grooves 3 and 3 through Y links 4 and 4 and moved inward or outward, simultaneously, in the direction of Y axis when a disc 5 rotates forward or reversely under control of a controller, and the sliding parts 2 and 2 are provided, respectively, with parts 6, 6, 7, 7 for clamping a wafer A. The clamping parts 7 and 7 are arranged to move above the sliding parts 2 and 2 in the direction of X axis through an X link 8 when a disc 9 rotates under control of the controller. A hole 10 for ejecting air through an air tube 11 connected with a compressor (not shown) is made in the body 1 of the robot hand and contact with the body 1 due to drooping of the wafer A is prevented by pushing up the wafer A held by ejected air to become substantially level.