Title:
室温硬化性エポキシ接着剤
Document Type and Number:
Japanese Patent JP2012517503
Kind Code:
A
Abstract:
Room temperature curing epoxy adhesives are described. The adhesives contain an epoxy resin, an acetoacetoxy-functionalized compound, a metal salt catalyst, a first amine curing agent having an equivalent weight of at least 50 grams per weight of amine equivalents and a second amine curing agent having an equivalent weight of no greater than 45 grams per weight of amine equivalents.
Inventors:
Michael A. Crop
Application Number:
JP2011549233A
Publication Date:
August 02, 2012
Filing Date:
February 03, 2010
Export Citation:
Assignee:
3M INNOVATIVE PROPERTIES COMPANY
International Classes:
C09J163/00; C08G59/56; C09J11/04; C09J11/06; C09J109/02; C09J151/00; C09J163/02
Domestic Patent References:
| JP2004183334A | 2004-07-02 | |||
| JPS5447734A | 1979-04-14 | |||
| JPH0953053A | 1997-02-25 | |||
| JP2001151862A | 2001-06-05 | |||
| JP2008156605A | 2008-07-10 | |||
| JPH09296027A | 1997-11-18 | |||
| JPS62243616A | 1987-10-24 | |||
| JP2000309625A | 2000-11-07 | |||
| JP2003041227A | 2003-02-13 | |||
| JP2005200948A | 2005-07-28 | |||
| JPH05156225A | 1993-06-22 | |||
| JP2007191527A | 2007-08-02 | |||
| JPS62227980A | 1987-10-06 |
Foreign References:
| WO2008089410A1 | 2008-07-24 |
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Atsushi Ebiya
Nagasaka Tomoyasu
Satoshi Deno
Takashi Ishida
Tetsuji Koga
Atsushi Ebiya
Nagasaka Tomoyasu
Satoshi Deno
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