Title:
室温硬化性オルガノポリシロキサン組成物及び物品
Document Type and Number:
Japanese Patent JP7276245
Kind Code:
B2
Abstract:
To provide a room temperature-curable organopolysiloxane composition having excellent adhesiveness, water-resistant adhesiveness and usability with respect to engineering plastics (nylon 66, polybutylene telephthalate, polyphenylene sulfide or the like) expanding application in recent years, and widely used metals (aluminum, iron, stainless steel or the like), and to provide every kind of an article having the composition or its cured material.SOLUTION: With respect to a specific organopolysiloxane composition, there are combined a polymer in which a terminal group of a polyphenylene ether is alkoxysilylated, and a hydrolyzable organosilane compound having a nitrogen functional group-containing monovalent hydrocarbon group and/or its partial hydrolyzable condensate.SELECTED DRAWING: None
Inventors:
Akira Datsuma
Tetsuro Yamada
Munenao Hirokami
Tetsuro Yamada
Munenao Hirokami
Application Number:
JP2020085637A
Publication Date:
May 18, 2023
Filing Date:
May 15, 2020
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C08L83/04; C08K5/54; C08L71/12; C09D171/12; C09D183/04; C09J171/12; C09J183/04; C09K3/10; F16J15/14
Domestic Patent References:
| JP2018016709A | ||||
| JP2019077761A | ||||
| JP2006282777A |
Foreign References:
| WO2016117206A1 |
Attorney, Agent or Firm:
Patent Attorney Corporation Eimei International Patent Office