Title:
ROTATABLE COATING METHOD
Document Type and Number:
Japanese Patent JPS5670634
Kind Code:
A
Abstract:
PURPOSE:To enable uniform coating of a photoresist including no foreign material in resin by directing downwardly the surface to be coated of a semiconductor substrate, bringing the substrate into contact with the resin liquid surface while rotating the substrate, isolating both and rotating the substrate. CONSTITUTION:The semiconductor substrate 25 is so set at a wafer chuck 24 connected to a motor 27 that the surface to be coated becomes downside, is lowered downwardly while rotating the motor 27, and is brought into contact with the liquid surface 23 of the photoresist 22 filled in the tank 21 more than once. Then, the chuck 24 is moved upwardly, the surface 26 of the substrate 25 is isolated from the photoresist 26, and the motor is rotated, thereby coating the photoresist film thereon. Since no air bubble occurs in the contacting boundary and foreign material can be, even if existed on the surface of the wafer, removed due to frictional resistance in the liquid surface, the photoresist can be uniformly coated thereon.
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Inventors:
KURODA SATORU
Application Number:
JP14840979A
Publication Date:
June 12, 1981
Filing Date:
November 15, 1979
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
H01L21/30; B05C9/02; B05C11/08; B05D1/40; B05D7/00; G03F7/16; H01L21/027; (IPC1-7): B05D7/00