Title:
ROUGHENED COPPER FOIL, COPPER-CLAD LAMINATE AND PRINT CIRCUIT BOARD
Document Type and Number:
Japanese Patent JP2022085378
Kind Code:
A
Abstract:
To provide a roughened copper foil that enables the manufacture of a print circuit board, etc. having excellent adhesion with a resin, low transmission loss, and a low risk of a short circuit due to migration.SOLUTION: A roughened copper foil has a roughened surface on which a plurality of roughening particles 1 are formed on at least one surface, with ruggedness formed on the surface of the roughening particles 1. The expansion area ratio Sdr of the interface of the roughened surface measured with a three-dimensional white light interference type microscope is 1000% or more and 5000% or less, and the arithmetic average roughness Sa of the roughened surface is 0.04 μm or more and 0.6 μm or less.SELECTED DRAWING: Figure 1
Inventors:
KATAHIRA SHUSUKE
SHINOZAKI ATSUSHI
KASAHARA MASAYASU
SANO JUNRO
TAKASAWA RYOJI
NAKASAKI RYUSUKE
SHINOZAKI ATSUSHI
KASAHARA MASAYASU
SANO JUNRO
TAKASAWA RYOJI
NAKASAKI RYUSUKE
Application Number:
JP2020197026A
Publication Date:
June 08, 2022
Filing Date:
November 27, 2020
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD
International Classes:
C25D7/06; C25D5/16; C25D5/48; H05K1/09
Domestic Patent References:
| JP2018141229A | 2018-09-13 | |||
| JP2017208461A | 2017-11-24 |
Foreign References:
| WO2019188712A1 | 2019-10-03 | |||
| WO2018211951A1 | 2018-11-22 | |||
| WO2020031721A1 | 2020-02-13 |
Attorney, Agent or Firm:
田中 秀▲てつ▼
Yuki Yamada
Tetsuya Mori
Yuki Yamada
Tetsuya Mori