RUBBER-MODIFIED RESIN COMPOSITION - MITSUBISHI CHEM CORP

Title:

RUBBER-MODIFIED RESIN COMPOSITION

Document Type and Number:

Japanese Patent JP2000191867

Kind Code:

A

Abstract:

To provide a rubber-modified resin composition having a well balanced impact resistance, gloss property, rigidity, heat resistance and molding processibility.

The titled composition comprises the following components (A)-(D). Component (A): from 90 to 30 pts.wt. polymer prepared by polymerizing 100 pts.wt. monomer mixture comprising an aromatic vinyl monomer and a vinyl cyanide monomer, from 0 to 75 pts.wt. phenyl maleimide and from 0 to 40 pts.wt. copolymerizable monomer, component (B): from 10 to 70 pts.wt. polymer prepared by graft polymerizing an aromatic vinyl monomer and a vinyl cyanide monomer in the presence of a rubbery polymer comprising from 0 to 100 wt.% conjugated diene, from 0 to 98.8 wt.% butyl acrylate, from 0 to 40 wt.% monoethylene compound and from 0 to 5 wt.% compound having a plurality of polymerizable double bonds, component C: from 0.1 to 10 pts.wt. thermoplastic polymer, component D: from 0 to 10 pts.wt. auxiliary.

Inventors:

SETSU TOHITSU
KAKU MEISHU
KISHIMOTO MANABU
UENO KOICHI

Application Number:

JP37116098A

Publication Date:

July 11, 2000

Filing Date:

December 25, 1998

Export Citation:

Click for automatic bibliography generation Help

Assignee:

MITSUBISHI CHEM CORP
QIMEI IND CO LTD

International Classes:

C08K5/01; C08K5/05; C08K5/09; C08K5/098; C08K5/10; C08K5/20; C08L25/02; C08L25/04; C08L25/16; C08L33/08; C08L33/12; C08L33/20; C08L35/00; C08L51/04; C08L91/06; C08L93/04; (IPC1-7): C08L25/02; C08K5/01; C08K5/05; C08K5/09; C08K5/098; C08K5/10; C08K5/20; C08L25/04; C08L25/16; C08L35/00; C08L51/04; C08L91/06

Attorney, Agent or Firm:

Kazuo Sato (2 outside)

Previous Patent: MARRING RESISTANT RESIN COMPOSITION AND MOLDED ARTICLE THEREFROM

Next Patent: AUTOMOBILE CANISTER HOUSING MATERIAL