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Patent Searching and Data


Title:
RUBBER-WASTE-CONTAINING COMPOSITION
Document Type and Number:
Japanese Patent JPH06172589
Kind Code:
A
Abstract:

PURPOSE: To obtain the title composition which can give e.g. tiles prevented from undergoing deformation due to thermal expansion resulting from a change in the air temperature and being capable of being laid without the necessity for adjusting gaps of joints by mixing chips of rubber wastes with wood chips and a rubber adhesive in a specified mixing ratio.

CONSTITUTION: The composition is obtained by mixing 100 pts.wt. chips of rubber wastes with 10-60 pts.wt. wood chips and 5-20 pts.wt. rubber adhesive. This composition can give tiles or blocks minimized in the defect arising from thermal expansion inherent in products made of rubber chips by the effect of the wood chips and the adhesive used in a specified ratio. Therefore the application field of rubber wastes and wood wastes can be extended. Compression-molding this composition under heating provides a product which still retains water permeability and has softness which is an inherent merit of natural wood material.


Inventors:
SHINDO TAKETO
Application Number:
JP35218792A
Publication Date:
June 21, 1994
Filing Date:
December 10, 1992
Export Citation:
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Assignee:
C K B KK
International Classes:
C08L21/00; C09J117/00; C09J121/00; E01C5/22; E02B3/14; E04F15/10; (IPC1-7): C08L21/00; C09J117/00; E01C5/22; E02B3/14; E04F15/10
Attorney, Agent or Firm:
Oda Haruka