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Patent Searching and Data


Title:
SAW MOTHER PLATE CARRYING METHOD OF SAW TOOTH CUTTING DEVICE
Document Type and Number:
Japanese Patent JPH04106035
Kind Code:
A
Abstract:

PURPOSE: To peel adhesion between mother plates for saw securely, and carry them securely one by one the saw tooth cutting machine side for supply, by vertically bending a right and a left side parts of a saw mother plate being sucked with a sucker through a drive of an upper end of a cylinder.

CONSTITUTION: A side surface of the top mother plate(a) of multi-piled mother plates(a) for saw on a place part 4 for mother plates for saw is sucked by sucker 12 provided on the tip of a cylinder rod 11, and when it is floated, a right side and a left side parts of the mother plate(a) for saw sucked by the sucker 12 are bent up and down by the drive of an upper end of a cylinder 9. Other mother plates(a) for saw, which adhere onto the lower side of the sucked mother plate(a) for saw, are peeled to fall to the place part 4 for mother plates for saw. Thereafter, a moving member 6 to which the cylinder 9 is fitted is moved to guide one mother plate(a) for saw sucked by the sucker 12 onto a saw plate supplying stand 13 of a saw tooth cutting machine part 1.


Inventors:
NANBA TARO
Application Number:
JP22356390A
Publication Date:
April 08, 1992
Filing Date:
August 24, 1990
Export Citation:
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Assignee:
NAKAYA NOKOGIRI KIKAI SEISAKUS
International Classes:
B23D63/08; B65H3/08; (IPC1-7): B23D63/08; B65H3/08
Domestic Patent References:
JPS59182135A1984-10-16
Attorney, Agent or Firm:
Riichi Ushiki