To reduce misalignment between a reticle and a wafer without exciting mechanical resonance, etc., of a stage system during scanning exposure.

Four positions WX1, WX2, WY1 and WY2 on a wafer stage which are measured with an interferometer 17 are supplied to a calculating means 15c. A calculation means 15c and differential devices 31X-31R found differences ΔRX, ΔRL and ΔRR between the target reticle stage position which is found based on the four positions, and the actual reticle stage position, and the differences are fed back to a reticle stage control system 17. Further, a correction speed αX.VW* corresponding to a tilt angle between the wafer stage and the reticle stage in the scanning direction is found with a calculating means 15d, and the correction speed is supplied to the reticle stage control system 17 by a feed forward method, for correcting the inclination angle.