Title:
SEAL BONDING MATERIAL
Document Type and Number:
Japanese Patent JPH05147974
Kind Code:
A
Abstract:
PURPOSE: To provide a seal bonding material contg. no poisonous matter and capable of seal-bonding a package at ≤330°C without placing load.
CONSTITUTION: This seal bonding material is a mixture of 45-90vol.% powder of glass or crystals with 10-55vol.% powder of a refractory material and the glass or crystals have a compsn. consisting of, by mol, 15-85% silver oxide and/or silver halide, 5-50% one or more among P2O5, GeO2 WO3 and MoO3, 0-40% one of the oxides of Pb, Ba, Sr, Ca, Zn, Cu, Mn and Bi and/or one of the halides of the elements and 0-25% one or more among TeO2, V2O5, B2O3, Nb2O5, Ta2O5, Fe2O3, SiO2 and Al2O3.
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Inventors:
YAMANAKA TOSHIRO
Application Number:
JP33614191A
Publication Date:
June 15, 1993
Filing Date:
November 25, 1991
Export Citation:
Assignee:
NIPPON ELECTRIC GLASS CO
International Classes:
C03C8/24; (IPC1-7): C03C8/24
Domestic Patent References:
| JPS488819A | ||||
| JPS51138711A | 1976-11-30 | |||
| JPS5230814A | 1977-03-08 | |||
| JPS5356208A | 1978-05-22 | |||
| JPS63315536A | 1988-12-23 | |||
| JPH02267137A | 1990-10-31 |