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Title:
SEALANT KIT, THERMOSETTING OR RADIATION-CURABLE SEALANT AND SEALING MEMBER
Document Type and Number:
Japanese Patent JP2010235817
Kind Code:
A
Abstract:

To provide a sealant kit to be used when a polymer material or the like is sealed, a sealant and a sealing member.

The sealant kit is used for preparing the following sealant by mixing a liquid composition (I) with another liquid composition (II) at an optional volume ratio. The sealant is composed of the liquid composition (I), that contains one or more of (A), (B) and (C), and (D) but does not contain (E), and the liquid composition (II), that contains one or more of (A), (B) and (C), and (E) but does not contain (D) (wherein (A) is urethane (meth)acrylate; (B) is a compound having one ethylenic unsaturated group; (C) is a radiation polymerization initiator; (D) is organic peroxide; (E) is a polymerization promotor), so that the sealant becomes a liquid curable composition containing (A) of 5-50 mass%, (B) of 30-90 mass%, (C) of 0.01-10 mass%, (D) of 0.1-5 mass% and (E) of 0.01-0.5 mass%.

COPYRIGHT: (C)2011,JPO&INPIT


Inventors:
YAMAGUCHI CHUJI
TAKASE KATSUYUKI
KONDO KAZUYUKI
KUROSAWA TAKAHIKO
Application Number:
JP2009086317A
Publication Date:
October 21, 2010
Filing Date:
March 31, 2009
Export Citation:
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Assignee:
JSR CORP
International Classes:
C09K3/10; C08F290/06
Attorney, Agent or Firm:
Alga Patent Office, a patent business corporation
Miyuki Ariga
Toshio Takano
Toshio Nakajima
Masaki Murata
Hiroto Yamamoto