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Patent Searching and Data


Title:
SEALED LETTER
Document Type and Number:
Japanese Patent JPH10236030
Kind Code:
A
Abstract:

To make the productivity extremely high, and at the same time, make a mismatch of a sent information hard to generate by a method wherein a bonding part is provided between confronted surfaces of a section-form article, and a bonding is performed on the bonding part.

A bonding part 20 is respectively formed with a pressure- sensitive adhesive which firmly bonds to a degree wherein a peeling is impossible, on the peripheral edge parts of three edges without a folding line 5' on a paper surface 2a and a paper surface 3a which are confronted, on the peripheral edge parts of three edges without the folding line 5 on a paper surface and a paper surface 2b which are confronted, and on the peripheral edge parts of three edges without the folding line 5" of a paper surface 3b and a paper surface 4b which are confronted. At the same time, at a specified location on the inside of the bonding part 20 which is formed into a rectangular paper piece 8, a perforation 10 which is in parallel with respective edges of the rectangular paper piece 8, is formed. By folding the folding lines 5, 5' and 5" into a section-form in such a manner that a postage stamp surface may be exposed, a section-form article is made, and by pressing the section-form article, respective bonding parts 20 are bonded to each other, and this sealed letter is formed.


Inventors:
HAYASHI ETSUJI
Application Number:
JP6182597A
Publication Date:
September 08, 1998
Filing Date:
February 27, 1997
Export Citation:
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Assignee:
DAINIPPON PRINTING CO LTD
International Classes:
B42D15/02; B65D27/10; (IPC1-7): B42D15/02; B65D27/10
Attorney, Agent or Firm:
Atsumi Konishi