Title:
SEALED SEMICONDUCTOR DEVICE IMPROVED FOR THERMAL RADIATION
Document Type and Number:
Japanese Patent JPS57167642
Kind Code:
A
Abstract:
A packaged semiconductor device which provides for enhanced power dissipation is disclosed. The packaged semiconductor device includes a mounting pad which is formed from a material having a thermal conductivity which is within about 20% that of copper and a coefficient of thermal expansion which is within about 20% that of silicon. A semiconductor device is mounted on the mounting pad. A plurality of metal leads having short lead fingers extend into close proximity to the mounting pad. The leads are electrically connected to the semiconductor device. An encapsulation encloses the mounting pad and the semiconductor device and extends laterally beyond the lead fingers such that the ends of the leads extend from the encapsulation as connectors for the packaged semiconductor device.
Inventors:
UIRIAMU ESU FUII
Application Number:
JP17913781A
Publication Date:
October 15, 1982
Filing Date:
November 10, 1981
Export Citation:
Assignee:
FAIRCHILD CAMERA INSTR CO
International Classes:
H01L23/29; H01L21/52; H01L23/31; H01L23/373; H01L23/433; H01L23/495; (IPC1-7): H01L21/58; H01L23/36
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