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Title:
SEALER COMPOSITION FOR INORGANIC FORMED PLATE
Document Type and Number:
Japanese Patent JP3920369
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To obtain a solvent-type acrylic resin based sealer composition for an inorganic formed plate, having a suppressing effect for the generation of an efflorescent phenomenon, also capable of giving a minute membrane, and having a good endurance, waterproof and surface reinforcing property for the inorganic formed plate.
SOLUTION: This sealer composition contains 75-96wt.% styrene-(meth)acrylic acid ester copolymer consisting of styrene and (meth)acrylic acid ester containing 0.5-4wt.% unsaturated carboxylic acid as major components and having a weight averaged molecular weight in the range of 5,000-20,000, and 25-5wt.% chlorinated paraffine.


Inventors:
Koji Mitani
Tadayoshi Morioka
Takeyasu Yamamoto
Sasaguri Hiroe
Tsutomu Imagawa
Application Number:
JP34528895A
Publication Date:
May 30, 2007
Filing Date:
December 06, 1995
Export Citation:
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Assignee:
Showa High Polymer Co., Ltd.
Nichiha Corporation
International Classes:
C09K3/10; E04C2/04; C08K5/00; C08K5/01; C08L25/14; C09D5/00; C09D125/00; C09D125/14; (IPC1-7): C09K3/10; C08K5/01; C08L25/14; C09D5/00; C09D125/14; E04C2/04
Domestic Patent References:
JP57044692A
JP2219868A
JP2233753A
JP55071747A
JP56079148A
JP7041682A
JP49029332A
Attorney, Agent or Firm:
Minoru Terada
Seiichi Kikuchi