Title:
SEALING CASTING METHOD
Document Type and Number:
Japanese Patent JPS59125631
Kind Code:
A
Abstract:
PURPOSE:To seal an electronic part to be sealed completely without deforming and distorting it by mixing a resin component and a curing-agent component immediately before a casting and filling a molding die with the mixture by specific injection pressure. CONSTITUTION:The resin components and the curing-agent components are mixed immediately before a casting, and the molding die is filled with the mixture by injection pressure of 0-50kg/cm<2>. For example, the resin components 1 in which 100pt. silica is added to a 100pts.wt. epoxy resin are entered into a resin tank 2, the curing-agent components 3 in which 10pt. imidazole is added to 100pt. N aminoethyl piperazine are entered separately into a curing-agent tank 4, and 11pt. curing-agent components are weighed automatically to 100pt. resin components by a weighing pump 5, introduced to a screw mixer 6, and sealed and casted to the molding die 9, to which the electronic part 8 is set previously, the injection pressure of 5kg/cm<2> from an injection port 7, thus obtaining a sealed casting 10. Injection pressure is made to be 0-50kg/cm<2> because the electronic part to be sealed is deformed and distorted when it exceeds 50kg/cm<2>.
Inventors:
TAKAISHI TERUHISA
Application Number:
JP84483A
Publication Date:
July 20, 1984
Filing Date:
January 06, 1983
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
B29C67/00; B29C43/00; B29C45/00; B29C61/00; H01L21/56; (IPC1-7): B29D3/00; B29G3/00
Attorney, Agent or Firm:
Toshimaru Takemoto