Title:
シール装置およびシール構造
Document Type and Number:
Japanese Patent JP4807210
Kind Code:
B2
Abstract:
A seal device has a for sealing a through hole in a partition includes a first seal for providing a first abutment portion that abuts against a periphery of the through hole in an entirety thereof, and a second seal for providing a second abutment portion that is made of an elastic material for abutting against an outer peripheral surface of a component disposed in the through hole. The first seal and the second seal are connected to cover an entire periphery of the through and the component, and a support member on the second seal has an inner surface shaped in a corresponding form of the component.
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Inventors:
Araki Yoshinori
Takuya Natsume
Takuya Natsume
Application Number:
JP2006265520A
Publication Date:
November 02, 2011
Filing Date:
September 28, 2006
Export Citation:
Assignee:
株式会社デンソー
International Classes:
B60H1/32
Domestic Patent References:
| JP2004237783A | ||||
| JP2002301927A | ||||
| JP2001026213A | ||||
| JP1178982A |
Attorney, Agent or Firm:
Kazuyuki Yahagi
Taihei Nonobe
Taihei Nonobe