Title:
SEALING EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE USING THE SAME
Document Type and Number:
Japanese Patent JP2001226456
Kind Code:
A
Abstract:
To obtain a sealing epoxy resin composition capable of providing a single side-sealed type package causing small warpage and excellent in reflow resistance and having excellent flame retardancy without containing an antimony compound and to provide a sealed single side-sealed type semiconductor device by using the sealing epoxy resin composition.
This sealing epoxy resin composition is characterized in that the composition comprises a triphenylmethane-type epoxy resin as an epoxy resin, a phenol novolak resin having 0-10 wt.% content ration of dikaryon as a curing agent and a red phosphorus-based flame retardant as a flame retardant. The single side-sealed type semiconductor device is sealed by using the sealing epoxy resin composition.
Inventors:
SUGIYAMA HIROSHI
TOYAMA TAKASHI
KUSHIDA TAKANORI
NAKAMURA MASASHI
TSUJI TAKAYUKI
TOYAMA TAKASHI
KUSHIDA TAKANORI
NAKAMURA MASASHI
TSUJI TAKAYUKI
Application Number:
JP2000038750A
Publication Date:
August 21, 2001
Filing Date:
February 16, 2000
Export Citation:
Assignee:
MATSUSHITA ELECTRIC WORKS LTD
International Classes:
C08K3/00; C08G59/32; C08G59/68; C08K3/02; C08K9/02; C08K9/04; C08L63/00; C08L83/04; H01L23/29; H01L23/31; (IPC1-7): C08G59/32; C08G59/68; C08K3/00; C08K3/02; C08K9/02; C08K9/04; C08L63/00; C08L83/04; H01L23/29; H01L23/31
Attorney, Agent or Firm:
Junji Ando (1 person outside)
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