To provide a sealing material for electronic component having excellent shock resistance and moisture-proof property, also provide a method and an apparatus for forming the material for electronic component assuring excellent productivity and an electronic component protected by the sealing material formed by the same method and apparatus.

The method for forming the sealing material for electronic component formed of a hardened substance obtained by hardening at least a kind of light-hardening composition is characterized by including a first hardening composition setting step of applying a first hardening composition to the periphery of a connecting terminal of an electronic component, a second hardening composition setting step of applying a second hardening composition to a part other than the periphery of the connecting terminal of the electronic component to which the first hardening composition is applied, and a hardening composition hardening step of hardening the light-hardening composition with the light.