Title:
封着材料ペーストとそれを用いた電子デバイスの製造方法
Document Type and Number:
Japanese Patent JP5716743
Kind Code:
B2
Abstract:
A sealing material paste and a process for producing an electronic device are provided, which realize suppressing with good reproducibility generation of bubbles in a sealing layer when a rapid heating-rapid cooling process with a temperature-rising speed of at least 100° C./min is applied to seal two glass substrates together. The sealing material paste, wherein the amount of water is at most 2 volume %, is applied on a sealing region of a glass substrate 2, and such a coating film 8 is fired to form a sealing material layer 7. The glass substrate 2 is laminated with another glass substrate via a sealing material layer 7, and they are heated with a temperature-rising speed of at least 100° C./min to be sealed together.
Inventors:
Toshihiro Takeuchi
Satoshi Fujimine
Kazuo Yamada
Satoshi Fujimine
Kazuo Yamada
Application Number:
JP2012520444A
Publication Date:
May 13, 2015
Filing Date:
June 13, 2011
Export Citation:
Assignee:
Asahi Glass Co., Ltd.
International Classes:
C03C8/24; H01J9/26; H01J11/48; H01L51/50; H05B33/04; H05B33/10
Domestic Patent References:
| JP2010047441A | 2010-03-04 | |||
| JP2009227566A | 2009-10-08 | |||
| JP2001019473A | 2001-01-23 | |||
| JP2004277259A | 2004-10-07 |
Attorney, Agent or Firm:
Patent Business Corporation Sakura International Patent Office